There are great efficiency gains to be made in FIMMPROP by exploiting symmetry and repeated structures; with larger devices being simulated in MT-FIMMPROP, even more efficiency gains can be found.

MT-FIMMPROP allows users to build a composite ‘sub-device’ while building a circuit which can be copied around the canvas. When the full device is simulated the result of one ‘sub-device’ is duplicated to all its copies.

FIMMPROP 8.1 allows sub-devices to be flipped in both x and z directions meaning symmetric sub-devices can be cut down their center and simulation time for that sub-device halved.

The large-scale improvement found in even these small changes continue to demonstrate how powerful the MT-FIMMPROP environment can be for the PIC component designer.

Also included in this update:

Realistic Ridge Walls in MT-FIMMPROP - match your simulations to your fabrication to create more faithful models of your waveguide. Now add tilts and corner rounding to your MT-FIMMPROP simulations. 

Tip - Use FIMMPROP’s parameter sweep to see how the device output changes as corner rounding/ wall tilt increases to find the range of outputs you could expect to see in fabrication.

• Powerful new mode filters allow waveguide modes to be selected based on many different mode properties, e.g. “is the mode leaky?”, “is it confined to waveguide X?”, “is it TE-like polarised?”.

FEM improvements for FIMMPROP –The FEM Mode Solver is now upgraded to have all the advantages of the FDM Mode Solver while maintaining the accuracy advantage of FEM. This leads to much faster FEM-FIMMPROP simulations using less memory in many cases.