New! Multi Topology (MT)-FIMMPROP; Our Latest Innovation for Waveguide Simulations
We’re pleased to announce the release of MT- FIMMPROP, the new additional module to
FIMMPROP that expands the use of our market leading EigenMode Expansion method into a new
domain of waveguide devices.
Simulation and Layout Environment – MT-FIMMPROP’s fully schematic environment
allows users to see devices as they would appear on chip. this means MT-FIMMPROP now combines
the function of 3 traditional photonics design tools into one - a component simulator, a circuit
simulator and a layout tool with GDS-II generation/export
Learn more about MT-FIMMPROP.
Improvements across the board with OmniSim 8.1
We’re happy to announce OmniSim’s latest version 8.1 with upgrades in many areas. To name a few:
• The total field/ scattered field exciters are now included in the FDTD engine, giving users the tools to conveniently investigate scattering due to an individual element in a bound volume.
• Efficiency gains have been made in both FDTD and FETD when rerunning simulations if the device is unchanged since a previous calculation by reusing rendered structures/ meshes that have been built.
• Beam exciters in the ZX plane can now be titled, offering further freedoms for simulations with FDTD and 2D FETD.
• Multiple bug fixes.
Simulating Nitride Lasers with Harold 7.1
We are pleased to announce the release of Harold version 7.1.
This update features a wurzite material model to allow simulation of short wavelength nitride-based devices.
Harold 7.1 also includes:
• Support for non-linearly graded layers.
• A thermionic emission model for computing carrier flow across heterojunctions in HaroldXY and VCSEL.
• Improvements to the accuracy of the refractive index spectra in HaroldQCSE.
• Multiple bug fixes.
Simulating the Smallest of Details with EPIPPROP 3.4
We are pleased to announce the release of EPIPPROP version 3.4.
This update allows you to examine the tolerance of your device with real world effects:
• Model manufacturing defects by introducing variations to the layer thickness with either a random noise profile or an imported file.
• Vary the temperature and refractive index over the area of the chip as defined by an import file.
In addition, the new ‘Etch & Fill’ process type allows for far more flexible waveguide geometries.
EPIPPROP 3.4 also includes:
• Improved calculation of optical path length for each output waveguide.
• Multiple bug fixes.
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